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Below is a short list of the IPC approved SIR testing methods used by PAL. The typical SIR analysis lasts 1 week (168 hours) in a constant 85 degree C/85% relative humidity environment. In addition to the IPC specs, we have the capability of peforming other testing methods. Please contact us regarding your needs.
What is Surface Insulation Resistance?
- Surface Insulation Resistance (SIR) is a test designed to expose a processed or unprocessed printed wiring substrate to elevated temperatures and humidity while applying an electrical potential. The goal is to determine if the residues measured by IC have the propensity for electro-migration. Below is a list of the SIR test vehicles available
IPC B-24, IPC B-36, IPC B-25, IPC B-25A, IPC B-52, Bellcore, Umpire, SMTA Saber
IPC-TM-650: Surface Insulation Resistance Test Methodologies
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2.6.3 Moisture and Insulation Resistance - Printed Boards
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This method is used to determine the degradation of insulating materials by way of visual examination and electrical insulation resistance properties of printed boards after being exposed to high humidity and heat conditions.
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2.6.3.1 Moisture and Insulation Resistance - Solder Mask
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This method is used to determine the moisture and insulation resistance of applied polymer solder mask under two prescribed conditions. One for Class H and one for Class T using the IPC-B25A test coupon.
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2.6.3.2 Moisture and Insulation Resistance - Flexible Base Dielectric
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This method defines procedures for determining the moisture and insulation resistance of a copper foils clad flexible dielectric material.
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2.6.3.3 Surface Insulation Resistance - Fluxes
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This test characterizes fluxes by determining the degradation of electrical insulation resistances in printed boards after exposure to the flux under elevated heat and humidity.
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2.6.3.4 Moisture and Insulation Resistance - Conformal Coatings
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This method is used to determine the insulation resistance and moisture of applied conformal coatings under prescribed temperatures and humidity.
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2.6.11 Hydrolytic Stability of Solder Mask and Conformal Coatings
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This test determines the resistance of applied solder mask or conformal coatings to reverting to liquid when exposed to high humidity at a given temperature and time condition. This is different for each manufacturing class (Class I, Class II or Class III). This method helps to evaluate the quality of printed boards under storage conditions.
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2.6.14 Resistance to Electrochemical Migration - Solder Mask
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This method assesses the propensity for surface electrochemical migration of soldering materials and/or processes.
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2.6.17 Hydrolytic Stability - Flexible Printed Wiring Material
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This method defines the procedure for determining a copper foil clad or unclad flexible dielectric material.
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