We want to do our part in improving the ever-changing electronics products that have made their way into nearly everyone's lives. Our mission is to serve our client to the fullest of our ability and answer their questions precisely and accurately. We will deliver the highest level of quality and integrity to our clients at reasonable rates and surpass their expectations.

Mr. Russeau has fourteen years of Ion Chromatography (IC) and Surface Insulation Resistance (SIR) testing experience. He has a background in Analytical Chemistry, Instrumental Chemistry, Physical Chemistry, and good laboratory practices. Mr. Russeau has an excellent working knowledge of many industry-testing protocols related to both IC and SIR. He has received IPC awards for his participation in the IPC SIR Round Robin Test Program and for his contributions to the development of IPC-9691A, the user guide for the conductive anodic filament test. In addition, Mr. Russeau currently serves as the chair of the IPC 7-11 Test Methods Subcommittee. He is also the the vice-chair of the 5-32A, Ionic Conductivity Task Group. His attention to detail and team-playing approach to problem solving help make PAL a "superior" testing service. Mr. Russeau's IC and SIR experience and knowledge have benefited many clients throughout the electronics industry. Mr. Russeau is committed to resolving his client's questions and takes that responsibility very seriously. Mr. Russeau has been happily married for six years and has one child.

Mr. Pauls holds a B.A. in Chemistry and Physics from Carthage College, in Kenosha, Wisconsin, and a B.S. in Electrical Engineering from the University of Wisconsin, Madison. He worked for the Naval Avionics Center in Indianapolis, Indiana for nine years as a Materials Engineer in the Materials Laboratory, doing investigations on materials properties, troubleshooting electronics manufacturing processes, and assisting the Navy in environmentally conscious manufacturing methods. Mr. Pauls spent 8 years as the Technical Director of Contamination Studies Laboratories, performing process troubleshooting and optimization from a residue analysis perspective. He is an active IPC Chairman (Cleaning and Coating Chairman, Bare Board Cleanliness, Solder Mask). Mr. Pauls is most notably known for his expertise in surface insulation resistance testing, cleanliness assessment, and how to qualify manufacturing processes. He is a U.S. representative to an ISO and IEC working groups on SIR and electromigration reliability standards. He has participated in numerous national and international consortia on electronics manufacturing materials and processes. Mr. Pauls is currently a senior materials and process engineer for Rockwell Collins, working on troubleshooting current manufacturing process and development of new materials and processes. Mr. Pauls is known to have a pathological fear of free time, has been happily married for 19 years and is the father of 3 young children.

Mr. Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins Inc. in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. He joined Rockwell International in June 1988. In his present assignment he serves as a consultant to manufacturing on material and processing problems. He is a principle investigator on a number of Collins electronic assembly process improvement investigations. He has published 40 Collins Working papers and has presented 7 Electronics Industry tutorials. He has published 38 Industry papers with the 1997 ISHM Conference paper being selected as "Best Paper of Session". Mr. Hillman was a recipient of the 1993 Rockwell Corporate Team Award and was awarded the Da Vinci medal as a Rockwell Engineer of the Year for 1994. He was a team member of the 1994 R&D 100 Award for the SERA Solderability Analysis System and the 1996 R&D 100 Award for the IS 4000 Impedance Spectroscopy System. He was awarded a patent in 1998 on the topic of Gold Wire Alloy for Microelectronics Applications. Mr. Hillman was a recipient of the IPC Presidents award in 1999 and the Distinguished Committee Service award in 2001. He also serves as the co-chairman of the IPC JSTD-002 and -003 Solderability committees. Mr. Hillman served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis prior to joining Rockwell. He is a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).